July 17, 2023

The SMT assembly process is closely related to each process step before welding, including capital investment, PCB design, component solderability, assembly operation, flux selection, temperature/time control, solder and crystal structure, etc. solder At present, the most commonly used solder for wave soldering is eutectic tin lead alloy: tin 63%; Lead is 37%, and the temperature …

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Surface mount technology, SMT includes: What is BGA, what is BGA, SMD, SMT component packaging: dimensions, dimensions, details, what is BGA, and what is BGA like Now look at any commercial electronic device, it is filled with tiny devices. These components are installed on the surface of the board, rather than using traditional components with …

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